Printed circuit board and manufacturing method thereof

A method of manufacturing a printed circuit board, the method comprising:

• forming a plurality of printing areas on a metal film of a wiring board and forming a plurality of alignment marks in each of the printing areas;
• forming a solder resist layer on the wiring board;
• generating measurement data by reading a wiring pattern;
• computing an error by comparing coordinates of the measurement data with coordinates of reference data;
• generating corrected data by correcting the reference date so as to correspond to the error;
• and
• forming a solder resist pattern by exposing the wiring board so as to correspond to the corrected data.