In-situ backside cleaning of semiconductor substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
InventorsMing-Hsi Yeh, Kuo-Sheng Chuang, Ying-Hsueh Chang Chien, Chi-Ming Yang, Chin-Hsiang Lin
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Abstract
The present disclosure provides a method and apparatus for cleaning a semiconductor wafer. In an embodiment of the method, a single wafer cleaning apparatus is provided and a wafer is positioned in the apparatus. A first chemical spray is dispensed onto a front surface of the wafer. A back surface of the wafer is cleaned while dispensing the first chemical spray. The cleaning of the back surface may include a brush and spray of cleaning fluids. An apparatus operable to clean the front surface and the back surface of a single semiconductor wafer is also described.
Claims20
An apparatus, comprising:
- a wafer positioning device operable to hold a semiconductor wafer in a first position;
- a first wafer cleaning device positioned on a first side of the first position, wherein the first wafer cleaning device includes a first nozzle for dispensing a chemical spray;
- a second wafer cleaning device positioned on a second side of the first position, the second side being on an opposite side of the first position as the first side, wherein the second wafer cleaning device includes a brush.
A method, comprising:
- providing a single wafer cleaning apparatus;
- disposing a wafer in the single wafer cleaning apparatus;
- dispensing a first chemical spray onto a front surface of the wafer;
- cleaning a back surface of the wafer while dispensing the first chemical spray.
A method of cleaning a semiconductor wafer, comprising:
- positioning the semiconductor wafer in a wafer positioning device;
- positioning a brush bar adjacent a backside of the semiconductor wafer in the wafer positioning device;
- dispensing a first spray onto a frontside of the semiconductor wafer while the semiconductor wafer is disposed in the wafer positioning device;
- and
- using a brush bar to clean the backside of the semiconductor wafer while the semiconductor wafer is disposed in the wafer positioning device.
Dependencies are inferred from the claim text.