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US 2013/0074764 A1Published application
Film-forming apparatus and manufacturing method for semiconductor device
OwnerHaruhiko Ishihara, Tsuyoshi Sato +1inventors
InventorsHaruhiko Ishihara, Tsuyoshi Sato, Kenechi Ooshiro
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Abstract
According to one embodiment, a film-forming apparatus includes a coating unit which introduces a liquid material to a substrate with a groove and fills the liquid material into the groove, thereby forming a liquid layer, a drying unit which solidifies the liquid layer by drying, and a vapor supply unit which applies a vapor to a surface of the liquid layer during the drying
Claims6
A film-forming apparatus comprising:
- a coating unit which introduces a liquid material to a substrate with a groove and fills the liquid material into the groove, thereby forming a liquid layer;
- a drying unit which solidifies the liquid layer by drying;
- and
- a vapor supply unit which applies a vapor to a surface of the liquid layer during the drying.
1 more element
A film-forming apparatus comprising:
- a coating unit which introduces a liquid material to a substrate with a groove and fills the liquid material into the groove, thereby forming a liquid layer;
- a drying unit which solidifies the liquid layer by drying;
- and
- a acoustic radiation unit which applies an acoustic wave to a surface of the liquid layer during the drying.
1 more element
A film-forming apparatus comprising:
- a coating unit which introduces a liquid material to a substrate with a groove and fills the liquid material into the groove, thereby forming a liquid layer;
- a drying unit which solidifies the liquid layer by drying;
- and
- a smoothing unit which relatively moves in contact with a surface of the liquid layer during the drying, thereby smoothing the surface.
1 more element
Dependencies are inferred from the claim text.