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US 2013/0074592 A1Published application
Tire pressure monitoring system module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Woo HAN, Hee Bum LEE, Jong In NA, Jong Hyeong SONG
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Abstract
Disclosed herein is a tire pressure monitoring system module including: a circuit board having electronic components and electrical elements mounted thereon to transceive electrical signals; a battery mounted on a lower portion of the circuit board to thereby form a double layer structure together with the circuit board; a valve antenna provided at a side portion of the circuit board; and a connection pin connecting the circuit board and the valve antenna to each other.
Claims7
A tire pressure monitoring system module comprising:
- a circuit board having electronic components and electrical elements mounted thereon to transceive electrical signals;
- a battery mounted on a lower portion of the circuit board to thereby form a double layer structure together with the circuit board;
- a valve antenna provided at a side portion of the circuit board;
- and
- a connection pin connecting the circuit board and the valve antenna to each other.
2 more elements
Dependencies are inferred from the claim text.