Carrier tape winding unit and apparatus of packing semiconductor package

An apparatus of packing a semiconductor package, comprising:

• a carrier tape supply unit configured to provide a carrier tape;
• a semiconductor package packing unit configured to pack a semiconductor package in the carrier tape by putting the semiconductor package into a pocket of the carrier tape and bonding a cover tape on a top surface of the carrier tape;
• and
• a carrier tape winding unit configured to wind the packed carrier tape, the carrier tape winding unit including,
• a winding reel configured to wind the packed carrier tape, and
• a carrier tape adhesion member configured to attach a front end of the packed carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the packed carrier tape after the completion of winding the carrier tape.

An apparatus of packing a semiconductor package, comprising:

• a winding reel;
• a transfer rail configured to guide a transfer of a carrier tape to the winding reel;
• a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support a portion of the carrier tape escaping from the transfer rail;
• a carrier tape holder configured to hold the carrier tape wound on the winding reel;
• and
• a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder to form a back end of the carrier tape at a location between an end portion of the transfer rail and a top or a bottom of a circumference surface of the winding reel.