US 2012/0268968 A1 · HEAT RADIATING PRINTED CIRCUIT BOARD AND CHASSIS ASSEMBLY HAVING THE SAME

Abstract

The present invention relates to a heat radiating printed circuit board (PCB) and a chassis assembly having the same, the heat-radiating PCB characterized by: a circuit pattern unit mounted with a light emitting diode; and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit, where one of the mounting units is mounted to the chassis via a thermal interface material to maximize the heat radiating characteristic of the PCB and to reduce the manufacturing cost.

Claims13

Dependent claims

A heat-radiating PCB (printed circuit board), comprising:

a circuit pattern unit mounted with a light emitting diode;
and one or more mounting units bent from the circuit pattern unit to be fixed at a chassis providing a lightguide path of a backlight unit,
wherein one of the mounting units is mounted to the chassis via a thermal interface mater.

Dependencies are inferred from the claim text.

Facts

Application

13/500,752Filed 8 Oct 2010

Priority

KR 10-2009-00958468 Oct 2009

Published

25 Oct 2012

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/0061
Laminating printed circuit boards onto other substrates, e.g. metallic substrates: onto a metallic substrate, e.g. a heat sink
G02B 6/0085
Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides,…:…
G02F 1/133314
Support structures for LCD panels, e.g. frames or bezels: back frames
G02F 1/133628
Illuminating devices: with cooling means

Heat radiating printed circuit board and chassis assembly having the same

Life of this patent

Heat radiating printed circuit board and chassis assembly having the same

Life of this patent

Abstract

Claims13