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US 2012/0268939 A1Published application
Method of laser processing
OwnerMoshe Finarov, Giora Dishon +1inventors
InventorsMoshe Finarov, Giora Dishon, Ehud Tirosh
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Abstract
A method of manufacturing a waveguide within a substrate by local modification of material structure under high power density laser radiation applied from the mostly distant side of the substrate.
Claims13
A method of processing a silicon substrate having a first and a second surface, the method comprising:
- selecting within said substrate a continuous region, the structure of which has to be modified by said processing;
- and
- selecting the surface of said substrate located most distantly from said continuous region;
- modifying the substrate structure in said continuous region by illuminating with a focused laser beam from the selected surface of said substrate and moving the focused laser beam along said continuous region.
1 more element
An apparatus for generating a modified material structure in a substrate, comprising:
- a laser emitting a laser beam;
- an objective configured to focus the laser beam in the material the structure of which has to be modified;
- and
- an aberration compensation mechanism supporting change of the distance between components of the objective to compensate for aberrations introduced by the substrate material.
1 more element
Dependencies are inferred from the claim text.