Mounting structure of circuit board having thereon multi-layered ceramic capacitor, method thereof, land pattern of circuit board for the same, packing unit for multi-layered ceramic capacitor taped horizontally and aligning method thereof

Abstract

A packing unit for a plurality of multi-layered ceramic capacitors including: a plurality of multi-layered ceramic capacitors having a thickness TMLCC equal or similar to a width WMLCC; and a packing sheet including a plurality of storing spaces, the capacitors being stored in the storing spaces and internal electrodes of each capacitor being substantially parallel with a bottom of the storing space. A related method includes: transferring a plurality of multi-layered ceramic capacitors having a thickness TMLCC equal or similar to a width WMLCC through a transferring unit; supplying magnetic field to a side of the capacitor so that the internal electrodes of the capacitor are substantially parallel with a bottom of the transferring unit; and storing the multi-layered ceramic capacitor in a storing space of a packing sheet so that the internal electrodes of the capacitor are substantially parallel with a bottom of the storing space.

Dependencies are inferred from the claim text.