Integrated circuit package system employing mold flash prevention technology
AssigneeSTATS ChipPAC, Ltd.
InventorsKi Youn Jang, Sungmin Song, JoHyun Bae
Life of this patent
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Abstract
An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.
Claims10
An integrated circuit package system comprising:
- a support structure including an electrical contact;
- a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface;
- an integrated circuit over the support structure;
- and
- encapsulant over the integrated circuit and in contact with the solder mask flange.
A mold system comprising:
- a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.
Dependencies are inferred from the claim text.