Formation of alpha particle shields in chip packaging

A system for fabricating a structure, comprising:

• means for bonding an integrated circuit to a top side of an interposing shield such that N chip electric pads comprised by the integrated circuit are in electrical contact with N electric conductors comprised by the integrated circuit, wherein N is a positive integer of at least 2, wherein the N chip electric pads are electrically connected to a plurality of devices on the integrated circuit, wherein the interposing shield has said top side and a bottom side, and wherein the interposing shield comprises a first semiconductor material;
• means for forming N solder bumps on the bottom side of the interposing shield such that the N solder bumps are in electrical contact with the N electric conductors;
• and
• means for bonding a ceramic substrate to the N solder bumps such that N substrate pads comprised by the ceramic substrate are bonded to the N solder bumps,
• wherein each electric conductor of the N electric conductors comprises an electrical pad, and
• wherein said means for bonding the integrated circuit comprises means for bonding the integrated circuit to the top side of the interposing shield such that the N chip electric pads are in electrical contact and direct physical contact with corresponding electrical pads of the N electric conductors.

A system for fabricating a structure, comprising:

• means for bonding an integrated circuit to a top side of an interposing shield such that N chip electric pads comprised by the integrated circuit are in electrical contact with N electric conductors comprised by the integrated circuit, wherein N is a positive integer of at least 2, wherein the N chip electric pads are electrically connected to a plurality of devices on the integrated circuit, and wherein the interposing shield has said top side and a bottom side, and wherein the interposing shield comprises a first semiconductor material;
• means for forming N solder bumps on the bottom side of the interposing shield such that the N solder bumps are in electrical contact with the N electric conductors;
• means for bonding a ceramic substrate to the N solder bumps such that N substrate pads comprised by the ceramic substrate are bonded to the N solder bumps;
• and
• means for forming a copper layer sandwiched between, and electrically insulated from, the N electric conductors and the N solder bumps.