US 2012/0267743 A1 · SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A solid-state imaging device and a method for manufacturing the same are provided. The solid-state imaging device includes a structure that provides a high sensitivity and high resolution without variations in spectral sensitivity and without halation of colors, and prevents light from penetrating into an adjacent pixel portion. A plurality of photodiodes are formed inside a semiconductor substrate. A wiring layer includes a laminated structure of an insulating film and a wire and is formed on the semiconductor substrate. A plurality of color filters are formed individually in a manner corresponding to the plurality of photodiodes above the wiring layer. A planarized film and a microlens are sequentially laminated on each of the color filters. In the solid-state imaging device, each of the color filters has an refraction index higher than that of the planarized film and has, in a Z-axis direction, an upper surface in a concave shape.

Claims12

Dependent claims

A solid-state imaging device comprising:

a semiconductor substrate including a plurality of light-receiving portions formed therein and individually having photoelectric conversion functions;
a wiring layer formed on the semiconductor substrate and having a laminated structure of an insulating film and a wire;
a plurality of color filters formed in a manner corresponding to the plurality of light-receiving portions individually on the wiring layer;
and
an upper layer formed on the plurality of color filters and including at least microlenses formed in a manner corresponding to the plurality of light-receiving portions individually,
wherein each of the color filters has a refraction index higher than a refraction index of a portion of the upper layer which makes contact with an upper surface of the color filter, and
the upper surface of the color filter in a direction of lamination has a concave shape.

4 more elements

A method for manufacturing a solid-state imaging device, comprising:

forming, inside a semiconductor substrate, a plurality of light-receiving portions individually having photoelectric conversion functions;
forming, on the semiconductor substrate, a wiring layer having a laminated structure of an insulating film and a wire;
forming, on the wiring layer, a plurality of color filters in a manner corresponding to the plurality of light-receiving portions individually, and
forming, on the plurality of color filters, an upper layer including at least microlenses individually corresponding to the plurality of light-receiving portions,
wherein, in said forming the plurality of color filters, the plurality of color filters are arranged to have a refraction index higher than a refraction index of a portion of the upper layer which makes contact with the upper surface of the color filter and to have the upper surfaces thereof, in the direction of lamination, in a concave shape.

2 more elements

Dependencies are inferred from the claim text.

Solid-state imaging device and method for manufacturing the same

Life of this patent

Solid-state imaging device and method for manufacturing the same

Life of this patent

Abstract

Claims12