Light emitting diode package and manufacturing method thereof
OwnerHun Yong PARK, Ji Hyun Kim +3inventors
InventorsHun Yong PARK, Ji Hyun Kim, Jae Sung You, Seong Deok Hwang, Young Hee Song
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Abstract
A light emitting diode (LED) package refracting or reflecting light emitted from an LED chip is disclosed. The LED package may include a substrate, an LED chip mounted on the substrate, a lens unit formed by injecting an encapsulant adapted to enclose and protect the LED chip, and at least one refraction member disposed in the lens unit. The at least one refraction member may refract or reflect the light emitted from the LED chip.
Claims24
A light emitting diode (LED) package comprising:
- a substrate;
- an LED chip mounted on the substrate;
- a lens unit formed by injecting an encapsulant adapted to enclose and protect the LED chip;
- and
- at least one refraction member disposed in the lens unit.
A light emitting diode (LED) package comprising:
- a package body comprising a cavity and a lead frame inserted at one side of a bottom surface of the cavity to be exposed on either side of the cavity;
- an LED chip mounted on the bottom surface of the cavity and electrically connected with the lead frame;
- a mold unit formed by injecting a mold resin in the cavity on which the LED chip is mounted;
- a lens unit formed by injecting a transparent resin on the mold unit;
- and
- at least one first refraction member disposed in the lens unit.
A manufacturing method for a light emitting diode (LED) package, the method comprising:
- preparing a substrate;
- mounting an LED chip on the substrate;
- forming a lens unit by injecting an encapsulant adapted to enclose and protect the LED chip;
- and
- forming at least one refraction member in the lens unit.
A manufacturing method for a light emitting diode (LED) package, the method comprising:
- preparing a package body that comprises a cavity and a lead frame inserted at one side of a bottom surface of the cavity to be exposed on either side of the cavity;
- mounting an LED chip on the bottom surface of the cavity;
- electrically connecting the LED chip with the lead frame;
- forming a mold unit by injecting a mold resin in the cavity on which the LED chip is mounted;
- forming a lens unit by injecting a transparent resin on the mold unit;
- and
- forming at least one refraction member in the lens unit.
Dependencies are inferred from the claim text.