Method for conductively connecting a component on a transparent substrate

A method for conductively connecting an electrical component with one of at least one strip conductor and one conductive layer, said method comprising the steps of:

• applying one of the strip conductor and the conductive layer to a transparent substrate which is transparent in a visible wavelength range of light, said transparent substrate including a heat-absorbing layer, the conductive layer being at the same time said heat-absorbing layer;
• providing one of the electrical component, the strip conductor, and the conductive layer with a soldering material in a region where the electrical component is to be connected with one of the conductive layer and the strip connector;
• supplying said soldering material with an energy which is automated and which is provided from an energy source which emits an electromagnetic radiation in such a way that said energy which is provided is essentially brought into one of a heat-absorbing said strip connector and a heat-absorbing said conductive layer at a location where the electrical component is to be attached so that said soldering material melts and a non-detachable, material-bonded, conductive connection between the electrical component and one of the strip connector and the conductive layer is formed at a minimal stress to the electrical component at a short soldering time.