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AssigneeRescoll
InventorsMarie-Pierre Foulc, Tomas Bergara, Maxime Olive
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An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young modulus tensile value at 25° C. of 500 MPa to 5 GPa, and includes at least one migrating agent suitable for migrating up to at least two interfaces of the joint (14) in order to generate interfacial detachment. A composition suitable for bonding the assembly, a method for assembling the assembly by bonding and a method for dismantling the bonded assembly via migration and creation of an interfacial detachment by heating the body thereof are also described.
Assembly (20), which can be disassembled by heating in its entirety, comprising a first substrate (10) and a second substrate (12) that are bonded with at least one seal (14), characterized in that said seal (14) consists of polymer material that has a Young's modulus value of tensile strength at 25° C. of between 500 MPa and 5 GPa, and comprises at least one migrating agent that can migrate up to at least one of the interfaces of the seal (14) to generate an interfacial detachment under the action of heat.
Dependencies are inferred from the claim text.