Cooling apparatus for optically pumped semiconductor laser

Apparatus, comprising:

• a heat-sink having a heat-sink surface;
• a diamond heat-spreader having first and second opposite surfaces;
• an OPS-chip having a multilayer semiconductor gain-structure surmounting a mirror structure, the mirror structure of the OPS-chip being soldered by a hard solder to the second surface of the heat-spreader and with the first surface of the diamond heat-spreader being soldered to the heat sink surface;
• and
• a metal frame having a top and a base, a recess in the base having dimensions greater than the dimensions of the diamond heat-spreader and an rectangular aperture having dimensions smaller than the dimensions of the diamond heat spreader, the diamond heat-spreader being soldered by the hard solder via the second surface thereof into the recess in the metal frame with the OPS-chip thereon in the aperture of the metal frame, the base of the metal frame being soldered to the heat sink surface.

An apparatus comprising:

• a metal heat sink with a planar surface;
• an OPS-chip;
• a diamond heat spreader interposed between and bonded to both the heat sink and the OPS chip, said diamond heat spreader having a thickness greater than 0.3 mm;
• and
• a metal frame bonded to the planar surface of the heat sink and having a central opening aligned with the OPS chip, said central opening having a peripheral shelf bonded to the surface of the heat spreader opposite to the heat sink.

An apparatus comprising:

• a metal heat sink with a planar surface;
• an OPS-chip;
• a diamond heat spreader interposed between the heat sink and the OPS chip with the upper surface of the head spreader being bonded to the OPS chip and the lower surface of the heat spreader being in thermal communication with the planar surface of the head sink;
• and
• a metal frame affixed to the planar surface of the heat sink, said metal frame having a central opening with dimensions larger than the dimensions of the OPS-chip, said central opening being aligned with the OPS chip, said central opening having a downwardly facing peripheral shelf soldered to the upper surface of the heat spreader in the region surrounding the OPS chip.