Microelectronic Assemblies
AssigneeRaytheon Company
InventorsShaun L. Champion, Philip H. Ives, Harry A. Andreas, Norman C. Lee, Karrie D. Dooley
Life of this patent
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Abstract
Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.
Claims20
A microelectronic assembly, comprising
- a first microelectronic module having a first group of N electrical interconnects (L1 through LN) and second group of N electrical interconnects (M1 through MN),
- wherein a quantity J of the first group of N electrical interconnects (L1 through LJ) of the first microelectronic module are consumed within the first microelectronic module and the remaining N−J electrical interconnects of the first group of electrical interconnects (LJ+1 to LN) of the first microelectronic module are electrically coupled to the 1 through N−J (M1 to MN−J) electrical interconnects of the second group of N electrical interconnects on the first microelectronic module;
- a second microelectronic module having a first group of N electrical interconnects (L1 through LN) and second group of N electrical interconnects (M1 through MN);
- and
- a first coupling medium that couples the second group of N electrical interconnects (M1 through MN) of the first microelectronic module to the first group of N electrical interconnects (L1 through LN) of the second microelectronic module;
- wherein there is no backplane electrical interconnect extending between each of the microelectronic modules.
A method for interconnecting microelectronic modules, comprising:
- consuming a quantity J (L1 through LJ) of a first group of N total electrical interconnects (L1 through LN) of a first microelectronic module and electrically coupling the remaining N−J electrical interconnects (LJ+1 through LN) of the first microelectronic module to 1 through N−J electrical interconnects on the first microelectronic module from a total of N electrical interconnects (M1 through MN);
- and
- electrically coupling, with a first coupling medium, the second group of N electrical interconnects (M1 through MN) of the first microelectronic module to a first group of N electrical interconnects (L1 through LN) of the second microelectronic module;
- wherein there is no backplane electrical interconnect extending between each of the microelectronic modules.
A microelectronic assembly, comprising:
- a first microelectronic module having a first group of N electrical interconnects (L1 through LN) and second group of N electrical interconnects (M1 through MN),
- wherein a quantity H of the first group of N electrical interconnects (LN−H+1 through LN) of the first microelectronic module are consumed on the first microelectronic module and a remaining N−H of the first group of electrical interconnects (L1 through LN−H) of the first microelectronic module are electrically coupled to the H+1 through N (MH+1 through MN) electrical interconnects on the first microelectronic module;
- a second microelectronic module having a first group of N electrical interconnects (L1 through LN) and second group of N electrical interconnects (M1 through MN);
- and
- a first coupling medium that couples the second group of N electrical interconnects (M1 through MN) of the first microelectronic module to a first group of N electrical interconnects (L1 through LN) of the second microelectronic module,
- wherein there is no backplane electrical interconnect extending between each of the microelectronic modules.
A method for interconnecting microelectronic modules, comprising
- consuming a quantity H (LN−H+1 through LN) of a first group of N total electrical interconnects (L1 through LN) of a first microelectronic module and electrically coupling the remaining N−H electrical interconnects (L1 through LN−H) of the first microelectronic module to the H+1 through N (MH+1 through MN) electrical interconnects on the first microelectronic module;
- and
- electrically coupling, with a first coupling medium, the second group of N electrical interconnects (M1 through MN) of the first microelectronic module to a first group of N electrical interconnects (L1 through LN) of the second microelectronic module;
- wherein there is no backplane electrical interconnect extending between each of the microelectronic modules.
Dependencies are inferred from the claim text.