Conductive metal micro-pillars for enhanced electrical interconnection

A method of forming a circuitized substrate for use in electronic packages, the steps comprising:

• a) providing a substrate layer having an upper surface and a lower surface;
• b) disposing a copper layer on said upper surface of said substrate layer;
• c) forming an interconnect pad on said copper layer;
• d) disposing a conductive seed layer on said upper surface of said substrate layer;
• and
• e) disposing an object on said conductive seed layer, said object selected from at least one of the group comprising:
• carbon, metal alloy, nanotube, nanowire, nanofiber, micro-fiber, micro-tube, and micro-wire.

A circuitized substrate for use in electronic packages comprising:

• a first circuitized substrate layer having a first surface containing a copper interconnect pad having a first plurality of micro-pillars disposed on a surface thereof;
• a second circuitized substrate layer having a second surface containing a copper interconnect pad having a second plurality of micro-pillars disposed on a surface thereof;
• and
• said micro-pillars of said first circuitized substrate layer and said second circuitized substrate layer being aligned and interfaced prior to lamination.

A method of forming an electrically conducting adhesive (ECA) or paste mixture with high metal loading, the method comprising:

• a) embedding a nanoparticle within a polymer constituent by adding a resin to a silver nanoparticle solution in a low temperature boiling solvent;
• b) dissolving said polymer constituent containing said nanoparticles in said silver nanoparticle solution by evaporating said low temperature boiling solvent to form an embedded nanoparticle polymer;
• c) combining said embedded nanoparticle polymer constituent with dry micro powder and an anhydride;
• and
• d) mixing said embedded nanoparticle polymer, anhydride, and micro powder.