Solid-state imaging apparatus, method for manufacturing the same, and electronic system

A method for manufacturing a solid-state imaging apparatus, the method comprising:

• providing a sensor unit in which a solid-state imaging device is mounted on a substrate and a bonding wire electrically connects a lead island formed on the substrate to a pad formed on the solid-state imaging device;
• covering the sensor unit with a frame member from above, the frame member having a frame-like shape that surrounds side portions of the solid-state imaging device and having a leg portion that is formed on a lower surface of the frame member and covers the pad from above;
• integrally fixing the frame member to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion;
• and
• accommodating a light-transmissive optical member in the frame member in such a way that the optical member faces an imaging surface of the solid-state imaging device.

An electronic system comprising:

• a solid-state imaging apparatus;
• and
• a signal processing circuit that processes a signal outputted from the solid-state imaging apparatus,
• the solid-state imaging apparatus including
• a solid-state imaging device mounted on a substrate,
• a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate,
• a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device, and
• a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device,
• wherein the frame member has a leg portion that covers the pad from above, and
• the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.