Method for defect inspection and apparatus for defect inspection
OwnerRyo Nakagaki, Minoru Harada +2inventors
InventorsRyo Nakagaki, Minoru Harada, Takehiro Hirai, Yuji Takagi
Life of this patent
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OwnerRyo Nakagaki, Minoru Harada +2inventors
InventorsRyo Nakagaki, Minoru Harada, Takehiro Hirai, Yuji Takagi
Estimating the term…
Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated.
A defect inspection apparatus comprising:
A defect inspection apparatus comprising:
A defect inspection apparatus comprising:
A defect inspection method comprising:
A defect inspection method comprising:
A defect inspection method comprising:
Dependencies are inferred from the claim text.