Method of cavity forming on a buried resistor layer using a fusion bonding process

A method of forming a buried resistor within a cavity for use in electronic packages, the steps comprising:

• a) providing a first glass impregnated dielectric layer having an upper surface and a first lower surface;
• b) forming a clearance hole in said first glass impregnated dielectric layer;
• c) providing a second glass impregnated dielectric layer having an upper copper coated surface and a second lower surface;
• d) removing a portion of said upper copper coated surface of said second dielectric layer, creating a resistor core on said upper copper coated surface;
• e) disposing said first dielectric layer on said upper copper coated surface of said second dielectric layer;
• and
• f) fusion bonding all of said layers together, forming a first subassembly, wherein said clearance hole in said first layer of said dielectric layer surrounds said resistor core on said upper copper coated surface.