Mold structures, and method of transfer of fine structures
AssigneeHitachi, Ltd.
InventorsMasahiko Ogino, Akihiro Miyauchi, Sigehisa Motowaki, Kosuke Kuwabara
Life of this patent
Estimating the term…
Abstract
A mold and a pattern transfer method using the same for a nanoprinting technology. The mold can be released from a substrate accurately and easily. The mold, which is used for forming a fine pattern on a substrate using a press machine, comprises a release mechanism.
Claims9
A pattern transfer method in which a stamper, on which a concave-convex pattern is formed, is pressed onto a resin substrate or onto a resin film on a substrate to transfer the concave-convex pattern of the stamper onto the resin substrate or onto the resin film on the substrate, the pattern transfer method comprising:
- a step in which the stamper, which comprises a curved surface on a side thereof on which the concave-convex pattern is formed, is pressed onto the resin substrate or onto the resin film on the substrate to form the concave-convex pattern on the resin substrate or on the resin film on the substrate as well as to curve the resin substrate or the substrate comprising the resin film;
- and
- a step in which the stamper is released from the resin substrate or from the resin film utilizing a forced exerted by the resin substrate or the substrate comprising the resin film as it tries to return from the curved state to its original state.
Dependencies are inferred from the claim text.