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US 2012/0256326 A1Published application
Adhesive composition, semiconductor device making use thereof, and production method thereof
OwnerKazuyuki Mitsukura, Takashi Kawamori +2inventors
InventorsKazuyuki Mitsukura, Takashi Kawamori, Takashi Masuko, Shigeki Katogi
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Abstract
Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.
Claims10
An adhesive composition used for adhesion of a semiconductor chip, comprising:
- a radiation polymerizable compound;
- a photoinitiator;
- and
- a thermosetting resin,
- wherein, when the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.
2 more elements
Dependencies are inferred from the claim text.