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US 2012/0256315 A1Published application
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
AssigneeInfineon Technologies AG
InventorsThorsten Meyer, Markus Brunnbauer, Jens Pohl
Life of this patent
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Abstract
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
Claims15
A semiconductor chip assembly, comprising:
- a first semiconductor chip,
- a second semiconductor chip, wherein
- the first and second semiconductor chips are attached to one another by using an adhesion layer.
A semiconductor chip assembly, comprising:
- a first semiconductor chip,
- a second semiconductor chip, wherein
- the first and second semiconductor chips are attached to one another by using an adhesion layer,
- wherein the first and second semiconductor chips each comprise a main surface having contact pads thereon and a back surface;
- wherein the back surface of the first semiconductor chip is attached to the main surface of the second semiconductor chip;
- and
- a mold material embedding the first and the second semiconductor chip.
4 more elements
Dependencies are inferred from the claim text.