Method of unifying device performance within die

A method of unifying device performance within an integrated circuit die, comprising:

• providing a layout of an integrated circuit die with multiple functional circuit blocks;
• filling a field between the multiple functional circuit blocks with dummy diffusion patterns;
• and
• filling the field between the multiple functional circuit blocks with strip-shaped, dummy gate patterns such that the strip-shaped, dummy gate patterns and the dummy diffusion patterns are partially overlapped and that two ends of each of the strip-shaped, dummy gate patterns protrude out of a longer side of the active area by a distance S that is less than a width W of the dummy diffusion pattern.

A method of unifying device performance within an integrated circuit die, comprising:

• providing a layout of an integrated circuit die with multiple functional circuit blocks;
• filling a field between the multiple functional circuit blocks with dummy diffusion patterns;
• and
• filling the field between the multiple functional circuit blocks with dummy gate patterns such that a reflectivity of the integrated circuit die is in a range of about 0.25-0.4.

A layout of an integrated circuit die, comprising:

• multiple functional circuit blocks;
• a field between the multiple functional circuit blocks;
• at least one dummy diffusion pattern within the filed;
• and
• at least one dummy gate pattern within the filed, wherein the dummy gate pattern and the dummy diffusion pattern are completely overlapped, wherein the dummy gate pattern has a surface area that is smaller than or equal to that of the dummy diffusion pattern.