Embedded mems sensors and related methods

A semiconductor device, comprising:

• a substrate;
• a first MEMS array comprising one or more first MEMS devices located over the substrate and configured to short for registering exposure to at least a first shock threshold level of a shockwave;
• an electronic device integrated with the substrate and the first MEMS array;
• a second MEMS device comprising:
• a second conductive base;
• and
• a second conductive membrane movably suspended over the second conductive base;
• and
• a second display element integrated with, and electrically coupled to, the second MEMS device;
• wherein:
• the substrate comprises a flexible substrate;
• at least a first MEMS device of the one or more first MEMS devices comprises:
• a first conductive base located over the substrate;
• a first sacrificial compartment located over the first conductive base and bounded by a compartment wall;
• and
• a first conductive membrane movably suspended over the first conductive base by the compartment wall;
• the first conductive membrane is configured to be deformed by the shockwave to permanently short with the first conductive base after being exposed to at least the first shock threshold level;
• the electronic device comprises:
• a first display element;
• and
• a first conductive path between the display element and the first MEMS array to source power to the display element when the first conductive membrane and the first conductive base of the first MEMS device are shorted together;
• the second conductive membrane is configured to short with the second conductive base after being exposed to at least a second shock threshold level to source power to the second display element;
• the substrate comprises at least one of a PEN material, a PET material, a PES material, a polyimide, a polycarbonate, a cyclic olefin copolymer, or a liquid crystal polymer;
• the first conductive membrane comprises at least one of a chromium material, a silver material, an aluminum material, a titanium material, or a copper material;
• the first conductive membrane comprises between approximately 5 openings to approximately 20 openings into the sacrificial compartment;
• the first MEMS device comprises a circular perimeter with a radius of between approximately 50 micrometers to approximately 250 micrometers;
• the first sacrificial compartment defines a first air gap of approximately 0.08 microns to approximately 2 microns between the first conductive membrane and the first conductive base;
• the first conductive membrane is substantially circular;
• the first MEMS device comprises a first sensitivity for the first shock threshold level, the first sensitivity being established by at least one of:
• a thickness of the first air gap;
• a diameter of the first conductive membrane;
• a thickness of the first conductive membrane;
• a rigidity of the first conductive membrane;
• or
• a material of the first conductive membrane;
• the second MEMS device comprises a second sensitivity for the second shock threshold level different from the first shock threshold level;
• and
• the first and second display elements are arranged to present a thermometer code indicative of a peak shock threshold level exposure.