Suction nozzle, mounting apparatus, method for mounting electronic components, and method for manufacturing component-mounted substrates
AssigneeSony Corporation
InventorTetsuya Kano
Life of this patent
Estimating the term…
Abstract
A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes includes a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode.
Claims8
A suction nozzle sucking a first electronic component that is mounted on a substrate and has first and second electrodes, the suction nozzle comprising:
- a first sucking area with an opening formed in an area corresponding to the first electrode;
- and
- a second sucking area with an opening formed in an area corresponding to the second electrode.
A mounting apparatus comprising:
- a head;
- and
- a suction nozzle adapted to be attached to the head and adapted to suck an electronic component that is mounted on a substrate and has first and second electrodes, the suction nozzle having a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode.
A method for mounting an electronic component having first and second electrodes, the method comprising:
- sucking the electronic component using a suction nozzle having a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode;
- and
- moving the suction nozzle having sucked the electronic component to a position above the substrate and mounting the electronic component on the substrate.
A method for manufacturing a component-mounted substrate, the method comprising:
- sucking an electronic component having first and second electrodes using a suction nozzle having a first sucking area with an opening formed in an area corresponding to the first electrode and a second sucking area with an opening formed in an area corresponding to the second electrode;
- and
- moving the suction nozzle having sucked the electronic component to a position above a substrate and mounting the electronic component on the substrate.
Dependencies are inferred from the claim text.