Composite acoustic backing with high thermal conductivity for ultrasound transducer array

Abstract

A backing block for an ultrasonic transducer array stack of an ultrasound probe is formed as a composite structure of material of high thermal conductivity in which is embedded a structure of acoustic dampening material. In a constructed embodiment the composite structure is formed from a block of thermally conductive graphite in which a plurality of cylindrical holes are formed which are filled with acoustic dampening material. The holes are angled in relation to the Z-axis direction from the rear of the transducer stack so that reverberation energy traveling in that direction will encounter acoustic dampening material. The graphite around the holes is effective to conduct heat to the rear of the probe and away from the transducer stack and its ASIC.

Dependencies are inferred from the claim text.