Positive photosensitive resin composition, cured film formed from the same, and device having cured film

A positive photosensitive resin composition containing a polysiloxane, a naphthoquinone diazide compound, and a solvent,

• wherein the polysiloxane contains an organosilane-derived structure represented by the general formula (1):
• wherein R1 represents an aryl group having 6 to 15 carbon atoms, plural R1s may be the same or different, R2 represents any of hydrogen, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 6 carbon atoms and an aryl group having 6 to 15 carbon atoms and plural R2s may be the same or different, and n represents an integer of 1 to 3, in an amount of 20% or more and 80% or less in terms of the ratio of the number of Si atom-moles to the number of Si atom-moles of the whole polysiloxane, and
• wherein the polysiloxane contains an organosilane-derived structure represented by the general formula (2):
• wherein R3 to R6 independently represent any of hydrogen, an alkyl group having 1 to 6 carbon atoms, an acyl group having 2 to 6 carbon atoms and an aryl group having 6 to 15 carbon atoms and m represents an integer of 1 to 11.