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US 2012/0237329 A1Published application
Thin Wafer Gripper Using High Pressure Air
OwnerGalle Lininventor
Life of this patent
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Abstract
The invention concerns thin wafer handling for solar silicone wafers or other semiconductor thin wafer handling applications, especially after back grind process. The invention performs high speed, mass wafer transfer between varying pitch carriers. Transfers are between various types of wafer carriers as required (plastic, Teflon, PEEK, SiC, etc.).
Claims2
Thin Wafer Grippers for Mass Wafer Transfer Using High Pressure Air:
- Provides mass transfer of wafers of any thickness, regardless of the wafer shape, or edge profile.
Mass Transfer with Pitch Change:
- Transfers wafers from carrier(s), performs reduced pitch and merge, and loads into receiving carrier(s). The technology provides fast and 100% secure merge during transfer.
Dependencies are inferred from the claim text.