US 2012/0237061 A1 · PROCESS FOR MANUFACTURING A MEMBRANE MICROELECTROMECHANICAL DEVICE, AND MEMBRANE MICROELECTROMECHANICAL DEVICE

Abstract

Disclosed herein is a microelectromechanical device and a process for manufacturing same. One or more embodiments may include forming a semiconductor structural layer separated from a substrate by a dielectric layer, and opening a plurality of trenches through the structural layer exposing a portion of the dielectric layer. A sacrificial portion of the dielectric layer is selectively removed through the plurality of trenches in membrane regions so as to free a corresponding portion of the structural layer to form a membrane. To close the trenches, the wafer is brought to an annealing temperature for a time interval in such a way as to cause migration of the atoms of the membrane so as to reach a minimum energy configuration.

Claims23

Dependent claims

A method comprising:

forming a structural layer on a dielectric layer on a semiconductor substrate;
opening a plurality of trenches through the structural layer in respective membrane regions, wherein the plurality of trenches expose a portion of the dielectric layer;
selectively removing a sacrificial portion of the dielectric layer through the plurality of trenches so as to cause a corresponding portion of the structural layer to be suspended, thereby forming a membrane;
and
closing the plurality of trenches, wherein closing the plurality of trenches comprises exposing the structural layer to an annealing temperature for a time interval.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

13/419,230Filed 13 Mar 2012

Priority

IT TO2011A00024118 Mar 2011

Published

20 Sep 2012

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

B81C 1/00158
Comprising flexible or deformable structures: diaphragms, membranes
B81C 1/00293
For maintaining a controlled atmosphere inside of the cavity containing the MEMS: maintaining a controlled atmosphere with processes not provided…
G01L 9/0042
Transmitting or indicating the displacement of flexible diaphragms: constructional details associated with semiconductive diaphragm sensors, e.g.…
G01L 9/0073
Using variations in capacitance: using a semiconductive diaphragm

Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

Life of this patent

Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

Life of this patent

Abstract

Claims23