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US 2012/0236668 A1Published application
Memory module with discrete heating element
AssigneeRambus Inc.
InventorsGary B. Bronner, Ming Li, Donald R. Mullen, Frederick Ware, Kevin S. Donnelly
Life of this patent
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Abstract
A memory module includes multiple memory devices mounted to a substrate and one or more discrete heating elements disposed in thermal contact with the memory devices. Each of the memory devices includes charge-storing memory cells subject to operation-induced defects that degrade ability of the memory cells to store data. The discrete heating elements, or single discrete heating element, heats the memory devices to a temperature that anneals the defects.
Claims28
A memory module comprising:
- a substrate;
- a plurality of memory devices disposed on the substrate, each of the memory devices having charge-storing memory cells that are subject to operation-induced defects that degrade ability of the memory cells to store data;
- and
- one or more discrete heating elements disposed in thermal contact with the plurality of memory devices to heat the memory devices to a temperature that anneals the defects.
1 more element
A method of operating memory module, the method comprising:
- performing, in memory devices of the memory module, operations that induce defects which degrade data storage ability of charge-storing memory cells within the memory devices;
- and
- enabling one or more discrete heating elements of the memory module to heat the memory devices to a temperature that anneals the defects.
An apparatus comprising:
- means for performing, in memory devices of a memory module, operations that induce defects which degrade data storage ability of charge-storing memory cells within the memory devices;
- and
- means for enabling one or more discrete heating elements of the memory module to heat the memory devices to a temperature that anneals the defects.
Dependencies are inferred from the claim text.