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US 2012/0236513 A1Published application
Hermetically Sealed Radio-Frequency Front End
AssigneeEADS Deutschland GmbH
InventorsHeinz-Peter Feldle, Bernhardt Schoenlinner, Ulrich Prechtel, Joerg Sander
Life of this patent
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Abstract
A hermetically sealed HF front end (e.g. a transmission/reception module) in a multilayer structure that includes electronic components is provided. The multilayer structure contains a plurality of substrates stacked one above the other and carrying the components. Grooves are formed in the substrates and sealing elements are provided between the substrates, which sealing elements engage in the grooves, and the substrates are soldered together.
Claims8
1-7. (canceled)
An HF front end in a multilayer structure comprising:
- electronic components,
- a plurality of substrates stacked one above the other and carrying the components;
- sealing elements arranged between the plurality of substrates to hermetically seal the structure,
- wherein the substrates include grooves and the sealing elements are arranged to engage in the grooves of adjacent substrates and adjacent substrates are soldered together.
1 more element
Dependencies are inferred from the claim text.