Passive, low-profile heat transferring system
AssigneeEldonTechnology Limited
InventorsMatthew Stephens, Bhavesh Tailor, Stewart Marlow, Robert Legg
Life of this patent
Estimating the term…
Abstract
A media content receiving device, such as a set top box, includes a thermally conductive chassis having at least one panel with opposing surfaces. One of the opposing surfaces is exposed to an ambient environment. A circuit board located within the chassis includes at least one integrated circuit chip. A thermally conductive heat transferring unit is bonded to and in thermal conductive contact with the chip. The heat transferring unit is arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat transfer proximate the chip. The heat transferring unit may be biased toward the panel.
Claims17
A system comprising:
- a thermally conductive chassis having at least one panel with opposing surfaces, and wherein one of the opposing surfaces is exposed to an ambient environment;
- a circuit board located within the chassis, the circuit board having at least one integrated circuit chip;
- and
- a thermally conductive heat transferring unit in thermal contact with the chassis, the heat transferring unit arranged to transfer heat from the chip to the at least one panel of the chassis while minimizing radiant heat build-up proximate the chip.
A chassis for a set top box comprising:
- a top panel defined by a top panel thickness, an interior surface, and an exterior surface exposed to an ambient environment;
- a periphery region of the chassis having a periphery region thickness that is greater than the top panel thickness;
- and
- a heat spreader in thermal contact with the chassis, wherein the heat spreader thermal conducts heat into at least one of the top panel or periphery region for dissipation to the ambient environment.
A method for transferring heat out of a media content receiving device, the method comprising:
- conductively transferring heat from an integrated circuit chip into a heat spreader located proximate the chip;
- conductively transferring heat from the heat spreader to a chassis panel of the media content receiving device, the heat spreader and chassis in thermal contact with each other;
- and
- transferring heat from the chassis panel to an ambient environment.
Dependencies are inferred from the claim text.