Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer

Method for determining a deformation of a mould wafer comprising the steps of:

• mounting an inner region of the mould wafer onto a mounting unit in a first mounting position;
• determining an eccentricity of a centre axis of the mould wafer from a centre axis of the mounting unit in the first mounting position;
• depositing the mould wafer onto a deposit unit;
• re-mounting the inner region of the mould wafer onto the mounting unit in a second mounting position based on the determined eccentricity, the eccentricity in the second mounting position being substantially zero;
• moving the mounting unit into a predetermined height position;
• measuring a deviation of a plurality of measuring points respectively in a non-mounted outer region of the mould wafer from the predetermined height position corresponding to the deformation by means of a fixed-height detector unit by rotating the mounting unit or the detector unit about suitable angles of rotation.
• wherein the mounting of the inner region of the mould wafer is effected using a plurality of support pins and a plurality of vacuum intake elements;
• wherein one support pin of the plurality of support pins (respectively is surrounded by an associated one of the plurality of vacuum intake elements respectively;
• wherein the vacuum intake elements comprise a respective lip seal, which surrounds the respectively associated support pin.