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US 2012/0235292 A1Published application
Heat radiating component and semiconductor package having the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsYoriyuki Suwa, Kenji Kawamura
Life of this patent
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Abstract
In one embodiment, there is provided a heat radiating component. The heat radiating component includes: a base material made mainly of copper; an electroplated aluminum layer that covers at least a part of a surface of the base material; and an alumite layer formed on the electroplated aluminum layer and formed by anodic-oxidizing the electroplated aluminum layer.
Claims6
A heat radiating component, comprising:
- a base material made mainly of copper;
- an electroplated aluminum layer that covers at least a part of a surface of the base material;
- and
- an alumite layer formed on the electroplated aluminum layer and formed by anodic-oxidizing the electroplated aluminum layer.
1 more element
Dependencies are inferred from the claim text.