Manufacturing method for an encapsulated micromechanical component, corresponding micromechanical component, and encapsulation for a micromechanical component
OwnerStefan Pinterinventor
Life of this patent
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Abstract
A manufacturing method for an encapsulated micromechanical component has the following steps: creating an intermediate substrate having a plurality of perforations; laminating an encapsulation substrate onto a front side of the intermediate substrate, which closes the perforations on the front side; laminating an MEMS functional wafer onto a rear side of the intermediate substrate; the MEMS functional wafer being aligned with the intermediate substrate in such a way that the perforations form cavities over the corresponding functional areas of the MEMS functional wafer.
Claims16
1-15. (canceled)
A method for manufacturing a micromechanical component, comprising:
- providing an intermediate substrate having a plurality of perforations;
- laminating an encapsulation substrate onto a front side of the intermediate substrate to close the perforations on the front side;
- and
- laminating an MEMS functional wafer onto a rear side of the intermediate substrate;
- wherein the MEMS functional wafer is aligned with the intermediate substrate in such a way that the perforations form cavities over corresponding functional areas of the MEMS functional wafer.
A micromechanical component, comprising:
- an intermediate substrate having a plurality of perforations;
- an encapsulation substrate laminated onto a front side of the intermediate substrate and closing the perforations on the front side of the intermediate substrate;
- and
- an MEMS functional wafer laminated onto a rear side of the intermediate substrate, wherein the MEMS functional wafer is aligned with the intermediate substrate in such a way that the perforations form cavities over corresponding functional areas of the MEMS functional wafer.
An encapsulation for a micromechanical component, comprising:
- an intermediate substrate having a plurality of perforations;
- and
- an encapsulation substrate laminated onto a front side of the intermediate substrate and closing the perforations on the front side of the intermediate substrate.
Dependencies are inferred from the claim text.