Encapsulant with index matched thixotropic agent

A light emitting diode (LED) package, comprising:

• an LED chip emitting light in response to an electrical signal;
• and
• an encapsulant over said LED chip, at least some of said LED light passing through said encapsulant, wherein said encapsulant has a thixotropic agent dispersed therein, with the encapsulant and thixotropic agent combination being substantially optically non-scatting to said LED light.

A light emitting diode (LED) package, comprising:

• an LED chip;
• and
• an encapsulant over said LED chip, said encapsulant having a encapsulant refractive index and having a thickening material with a refractive index that is within plus or minus n=0.05 of the encapsulant refractive index.

A light emitting diode (LED) package, comprising:

• an LED chip;
• and
• an encapsulant over said LED chip, said encapsulant having an encapsulant refractive index and having a thixotropic material with a refractive index that is approximately the same as said encapsulant refractive index.

A light emitting diode (LED) package, comprising:

• an LED chip;
• and
• an encapsulant over said LED chip, said encapsulant having a thickening material disposed therein, said thixotropic agent altering the mechanical properties of said encapsulant compared to the same encapsulant without said thickening material, without substantially altering the optical properties of said encapsulant.

A light emitting diode (LED) package, comprising:

• an LED chip;
• and
• an encapsulant over said LED chip, said encapsulant having a thickening material disposed therein, said thixotropic agent altering the thermal properties of said encapsulant compared to the same encapsulant without said thickening material, without substantially altering the optical properties of said encapsulant.