Optoelectronic Module Comprising at Least One First Semiconductor Body Having a Radiation Outlet Side and an Insulation Layer and Method for the Production Thereof

A method of producing an optoelectronic module comprising the steps of:

• A) arranging a first semiconductor body with a side remote from a radiation exit side on a carrier;
• B) applying an insulation material laterally next to the first semiconductor body on the carrier such that the insulation material takes the form of a fillet and is formed form-fittingly against the semiconductor body;
• C) subsequently applying an insulation layer in places on the semiconductor body and the insulation material;
• and
• D) subsequently applying at least one planar conductive structure onto the insulation layer for electrical contacting of the semiconductor body.

An optoelectronic module comprising at least one first semiconductor body with a radiation exit side, on which at least one electrical connection region is arranged, wherein:

• the first semiconductor body is arranged with its side opposite the radiation exit side on a carrier,
• an insulation material is arranged on the carrier laterally next to the first semiconductor body, which material forms a fillet and adjoins the semiconductor body form-fittingly,
• an insulation layer is arranged at least in places on the first semiconductor body and the insulation material,
• at least one planar conductive structure is arranged on the insulation layer for planar contacting of the first semiconductor body, which conductive structure is electrically conductively connected with the electrical connection region of the first semiconductor body,
• at least one second semiconductor body is arranged next to the first semiconductor body on the carrier,
• the insulation material form-fittingly adjoins the semiconductor bodies in regions between the semiconductor bodies,
• the insulation material adjoining outer sides of the first semiconductor body and the second semiconductor body in each case forms a fillet and form-fittingly adjoins the semiconductor bodies,
• the insulation material forms a ramp for the insulation layer, and
• a height of the insulation material in regions between the semiconductor bodies corresponds to the height of the respective semiconductor bodies.