Solid state optoelectronic device with preformed metal support substrate
AssigneeMicron Technology, Inc.
InventorVladimir Odnoblyudov
Life of this patent
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Abstract
A wafer-level process for manufacturing solid state lighting (“SSL”) devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, such as a copper-copper bond, or with an inter-metallic compound bond.
Claims21
A method of manufacturing a plurality of solid state lighting (“SSL”) devices, the method comprising:
- forming a metal bonding structure on a light emitting structure;
- and
- bonding a preformed metal substrate to the metal bonding structure, wherein the preformed metal substrate has a thickness sufficient to decrease bowing of the light emitting structure, wherein the bonding is based at least in part on heat, and wherein the preformed metal substrate is attached to a temporary carrier.
A method of manufacturing a plurality of solid state lighting (“SSL”) devices on a large diameter wafer, the method comprising:
- forming a first inter-metallic compound (“IMC”) stack on a light emitting structure, wherein the light emitting structure comprises a first semiconductor material, a second semiconductor material, and an active region between the first and second semiconductor materials;
- forming a second IMC stack on a preformed metal substrate, wherein the preformed metal substrate is formed separately from the light emitting structure and has a thickness sufficient to inhibit bowing of the light emitting structure;
- and
- bonding the first IMC stack to the second IMC stack such that the preformed metal substrate is attached to the light emitting structure, wherein the bonding is based at least in part on heat, and wherein the preformed metal substrate is attached to a temporary carrier.
21-24. (canceled)
Dependencies are inferred from the claim text.