Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof

A semiconductor light emitting diode chip, comprising:

• a substrate;
• a light emitting diode including a light emitting laminate formed in one area of the substrate and including first and second compound semiconductor layers and active layer formed between the first and second compound semiconductor layers, and first and second electrodes electrically connected to the first and second compound semiconductor layers, respectively;
• and
• at least one fuse signature circuit formed in the other area of substrate so as to be electrically insulated from the light emitting diode, and including a circuit unit having unique electrical characteristic value corresponding to wafer based process information and a plurality of electrode pads connected to the circuit unit so as to measure the electrical characteristic value;
• wherein the circuit unit includes a plurality of semiconductor elements and a plurality of fuses connected to the plurality of semiconductor elements, and the electrical characteristic value of the circuit unit is determined through selective cutting of the plurality of fuses.