US 2012/0235114 A1Published application

Light emitting chip

AssigneeHon Hai Precision Industry Co., Ltd.

InventorJIAN-SHIHN TSANG

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Abstract

A light emitting chip includes a substrate, a first reflective layer formed on the substrate, a lighting structure formed on the first reflective layer, and a first electrode formed between the first reflective layer and the substrate. The lighting structure includes a first semiconductor layer, an active layer and a second semiconductor layer. A receiving groove is defined in the lighting structure and extends from the first reflective layer to the first semiconductor layer. The receiving groove has a second reflective layer formed on an interior sidewall thereof. The first electrode includes a base and a connecting section extending upwardly from the base. The connecting section is surrounded by the second reflective layer and electrically connects with the first semiconductor layer. The first and second reflective layers each are electrically insulating.

Claims20

Dependent claims

A light emitting chip, comprising:

a substrate;
a first reflective layer formed on the substrate, the first reflective layer being made of electrically insulating material;
a lighting structure formed on the first reflective layer, the lighting structure comprising a first semiconductor layer, a second semiconductor layer and an active layer formed between the first semiconductor layer and the second semiconductor layer, the second semiconductor layer being adjacent to the first reflective layer;
a receiving groove extending from a bottom surface of the first reflective layer to the first semiconductor layer;
a second reflective layer made of insulating material being formed in the receiving groove and attached on a sidewall surrounding the receiving groove;
and
a first electrode formed between the first reflective layer and the substrate, the first electrode comprising a base and a connecting section extending upwardly from the base, the connecting section being surrounded by the second reflective layer and electrically connected with the first semiconductor layer.

4 more elements

Dependencies are inferred from the claim text.