Manufacturing method of a heat dissipation device with guiding lines and soldered heat pipes

A method of manufacturing a heat dissipation device, comprising:

• providing at least one heat pipe comprising a condenser section having a planar outer surface;
• providing a heat sink comprising a supporting surface defining at least one guiding line, the at least one guiding line having a width smaller than a width of the outer surface of the condenser section;
• spreading an amount solder on the supporting surface along the at least one guiding line to form at least one solder layer on the supporting surface, the at least one solder layer having a size not larger than a size of the outer surface of the condenser section;
• and
• attaching the outer surface of the condenser section of the at least one heat pipe to the at least one solder layer on the supporting surface of the heat sink.