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US 2012/0234588 A1Published application
Low cost high frequency device package and methods
AssigneeBridgewave Communications, Inc.
InventorsEric A. Sanjuan, Sean S. Cahill
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Abstract
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
Claims21
An electrical component package, comprising:
- a package having a plurality of leads and a base;
- a structure attached to said base, the structure having at least one site;
- and
- at least one waveguide interconnect connecting the at least one site on said structure to at least one of said plurality of leads of the package.
1 more element
Dependencies are inferred from the claim text.