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AssigneeApplied Materials, Inc.
InventorsJOHN TELLE, Brian J. Murphy, David H. Meakin
Estimating the term…
Embodiments of the invention generally relate to methods of forming flexible substrates for use in photovoltaic modules. The methods include shaping a metal foil and adhering the metal foil to a flexible backsheet. An optional interlayer dielectric and anti-tarnish material may then be applied to the upper surface of the shaped metal foil disposed on the flexible backsheet. The metal foil may be shaped using die cutting, roller cutting, or laser cutting techniques. The die cutting, roller cutting, and laser cutting techniques simplify the flexible substrate formation processes by eliminating resist-printing and etching steps previously used to pattern metal foils. Additionally, the die cutting, roller cutting, and laser cutting techniques reduce the consumption of consumable materials previously used in the patterning of metal foils.
A substrate for interconnecting photovoltaic devices, comprising:
A substrate for interconnecting photovoltaic devices, comprising:
A method of forming a substrate for interconnecting photovoltaic devices, comprising:
A method of forming a substrate for interconnecting photovoltaic devices, comprising:
A method of forming a substrate for interconnecting photovoltaic devices, comprising:
Dependencies are inferred from the claim text.