Non-Chemical, Non-Optical Edge Bead Removal Process
AssigneeMicron Technology, Inc.
InventorPeter A. Benson
Life of this patent
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Abstract
A method for removing the edge bead from a substrate by applying an impinging stream of a medium that is not a solvent for the material to be removed. The medium is applied to the periphery of the substrate with sufficient force to remove the material. Also an apparatus to perform the inventive method.
Claims18
An apparatus for semiconductor manufacturing, comprising:
- a substrate support;
- a mechanism configured to rotate the substrate support;
- and
- a device configured to deliver a high pressure stream of a non-chemical medium to a periphery of a wafer mounted on the substrate support.
A method of removing an edge bead of a material proximate to an outer edge of a substrate, comprising applying a non-chemical, non-aerosol gas without solid particles or liquid solvent under pressure onto the edge bead.
A method of removing an edge bead of a material proximate to an outer edge of a substrate, comprising applying a stream consisting of a non-chemical, non-aerosol gas under pressure onto the edge bead to remove at least a portion of said edge bead.
Dependencies are inferred from the claim text.