Electronic component mounting apparatus

An electronic component mounting apparatus (10) for mounting electronic components on a substrate, comprising:

• a head main body (30) including a nozzle (32) used for absorbing an electronic component, a nozzle driving section (34) driving the nozzle, and a head support (31) supporting the nozzle and the nozzle driving section;
• and
• a camera unit (36) fixed on the head support and imaging a tip of the nozzle,
• the camera unit containing:
• a camera module (51) including a camera (52) obtaining an image, a first lighting section that is disposed adjacently on a side of the camera closer to the nozzle and emits light toward an imaging region of the camera, a second lighting section that is disposed adjacently on a side of the camera farther from the nozzle and emits light toward the imaging region of the camera, and a baffle (58) blocking a part of light having been emitted from the first lighting section and the second lighting section and having been reflected in such a manner as to enter the camera;
• and
• a bracket (50) fixed on the head support and supporting the camera, the first lighting section, the second lighting section and the baffle.