Method for packaging a semiconductor structure

A method for packaging a semiconductor structure, comprising:

• providing a conductive substrate comprising a first surface, a first lateral surface and a second lateral surface adjacent to the first surface;
• providing a first electrode line and a second electrode line on the conductive substrate, wherein two ends of the first electrode line are provided on the first surface and the first lateral surface, and two ends of the second electrode line are provided on the first surface and the second lateral surface;
• providing a semiconductor device on the first surface of the conductive surface, and electrically connected to the first electrode line and the second electrode line;
• providing a protective plate with a through hole on the first surface of the conductive substrate to overlay the first surface, wherein the semiconductor device is inside the through hole;
• a sheathing provided inside the through hole to overlay the semiconductor device and to form a semiconductor packaging structure.