Removal of metal
AssigneeMicron Technology, Inc.
InventorsBrian Dolan, Robert J. Hanson, Chan Lim
Life of this patent
Estimating the term…
Abstract
Methods of removing metal from a portion of a substrate are useful in integrated circuit fabrication. Methods include exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent, and exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent.
Claims27
A method of removing metal from a portion of a substrate, comprising:
- exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent;
- and
- exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent.
A method of removing metal from a portion of a substrate, comprising:
- exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent;
- determining whether metal remaining on the portion of the substrate is less than or equal to a particular level;
- and
- if the metal is metal remaining on the portion of the substrate is deemed to be greater than the particular level, exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent.
A method of removing metal from a portion of a substrate, comprising:
- exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent;
- determining whether metal remaining on the portion of the substrate is less than or equal to a particular level;
- if the metal is metal remaining on the portion of the substrate is deemed to be greater than the particular level, exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent.
A method of removing metal from a portion of a substrate, comprising:
- performing an iterative process of two or more cycles of exposing the substrate to an oxidizing environment and exposing the substrate to a reducing environment;
- and
- ending the iterative process when the metal remaining of the portion of the substrate is deemed to be removed to less than or equal to a particular level;
- wherein the oxidizing environment comprises at least one oxidizing agent and at least one reducing agent;
- and
- wherein the reducing environment comprises at least one reducing agent and at least one oxidizing agent.
Dependencies are inferred from the claim text.