Wire wrap compositions and methods relating thereto

A wire wrap composition comprising:

• A) a polyimide layer, having a first surface and a second surface, the polyimide layer having a thickness from 5 to 150 microns, the polyimide layer comprising:
• a) a polyimide derived from:
• i) at least one aromatic dianhydride component selected from the group consisting of rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and
• ii) at least one aromatic diamine component selected from the group consisting of rigid rod diamine, non-rigid rod diamine and combinations thereof;
• wherein the mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine based upon the total dianhydride component and total diamine component of the polyimide;
• and
• b) a sub-micron filler:
• i) being less than 550 nanometers (as a numerical average) in at least one dimension;
• ii) having an aspect ratio greater than 3:1;
• iii) being less than the polyimide layer thickness in all dimensions;
• and
• iv) being present in an amount from 10 to 45 volume percent of the polyimide layer;
• and
• B) a bonding layer having a first surface and a second surface, the bonding layer first surface being adjacent to the polyimide layer first surface, the bonding layer comprising:
• i) a poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) in an amount from 65 to 100 weight percent based on the total weight of the bonding layer, or
• ii) a polyimide adhesive.