Temperature control system
AssigneesAida Engineering, Ltd., NEC Corporation
InventorsMinoru ASOGAWA, Hisashi HAGIWARA, Tohru HIRAMATSU
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AssigneesAida Engineering, Ltd., NEC Corporation
InventorsMinoru ASOGAWA, Hisashi HAGIWARA, Tohru HIRAMATSU
Estimating the term…
For heating or cooling a sample contained in a vessel portion through a heat transfer member held in contact with the vessel portion, there is used the vessel portion, which has a part formed of an elastic member, expands and contracts for injection and discharge of the sample, is closed other than a connecting port with a channel connected to the vessel, and expands and contracts for injection and discharge of the sample. The vessel portion expands correspondingly to the injection when the sample is injected through an inflow path serving as the channel into the vessel portion contracting in a non-contacting state with the heat transfer member. A predetermined amount of sample is injected into the vessel portion so as to expand the vessel portion, and the vessel portion comes into contact with the heat transfer member. The vessel portion is heated or cooled through the heat transfer member.
A microchip comprising a vessel portion containing a sample therein,
Dependencies are inferred from the claim text.